Each day 3 companies will have 15 minutes to present their technologies and an additional 5 minutes for Q&A with attendees.
Register now for Day 2 - Wednesday 19 August where the following companies will be presenting:
- EXFO | Meeting the challenges in spectral testing of photonic integrated circuits (PIC)
- Intlvac Thin Film | Protecting Silicon, Germanium and Chalcogenide Windows and Lenses with Intlvac Thin Film’s DLC Machine
- LightPath Technologies | Chalcogenide Lenses for IR Imaging
Registration is free and open to the public.